Components and technical solutions for power electronics

Series LXP 20 TO 220

20 Watt Thick Film Power Resistors for High Frequency and Pulse Loading Applications

 EBG offers the totally encapsulatedand insulated TO-220 package for low ohmic value and non-inductive design for high frequency and pulsing applications. Ideal use is for power supplies. This seriesis rated at 20 Watts mounted to a heatsink. The special features include:
 •20 Watt power rating at 25°C casetemperature
 •High pulse tolerant design
 •TO-220 package configuration
 •Snap-on style TO-220 heat sinkrequired
 •A totally molded housing forenviromental protection.
 •Non-Inductive design
 •Resistor package totally insulated fromheat sink.


 •Resistance Range: 0.05W to1MW other values on request
 •Resistance Tolerance:±1%, ±2%, ±5%, ±10% (0.5% onrequest)
 •Temperature Coefficient:10W and above, ±50ppm/°C,referenced to 25°C, DR taken at+105°C. Between 1W and 10W,±(100ppm + 0.002W)/°C,referenced to 25°C, DR taken at+105°C
 •Max. Operating Voltage: 350V
 •Dielectric Strength: 1,800V AC
 •Power Rating:20W at 25°C. Depends uponcase temperature. See DeratingCurve.
 •Insulation Resistance:10GW min.
 •Momentary Overload:2 times rated power with appliedvoltage not to exceed 1.5 timesmaximum continuous operatingvoltage for 5 seconds, DR ± (0.3%+ 0.001W) max.
 •Load Life:MIL-R-39009, 2,000 hours atrated power, DR ±(1.0% +0.001W).
 •Moisture Resistance:MIL-Std-202, Method 106, DR±(0.5% + 0.001W) max.
 •Thermal Shock:MIL-Std-202, Method 107, Cond. F,DR ±(0.3% + 0.001W) max.
 •Terminal Strength:MIL-Std-202, Method 211, Cond. A(Pull Test) 2.4N, DR ±(0.2% + 0.001W)max.
 •Vibration, High Frequency:MIL-Std-202, Method 204, Cond. D,DR ±(0.2% + 0.001W) max.
 •Lead Material: Tinned Copper
 • For pulse power details, please  see page 27 (datasheet UXP-300)!

Derating (thermal resistance): 0.16W/°K (6.25°K/W). Without a heatsink, when in free air at 25°C, the LXP20 is rated for 3W. By using the element with a snap-on heat sink the resistor is rated for 5W. Derating for temp. above 25°C is 0.018W/ °K. 

The case temperature is to be used for the definitiion of the applied power limit.
The case temperature measurement must be made with a thermocouple contacting the center of the component mounted on the designed heat sink.
Thermal grease should be applied properly.