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Air Cooled Heat sink 5SAA21V9000, 5SAA21V8500
Type YAP 3-05
Air cooled heat sink for double sided cooling of disc housing thyristors and diodes, diameter 40 - 75 mm.
Part number | Max contact diameter | Weight | RthHA at air flow measured with specified device contact diameter | RthHA at power dissipation measured with specified device contact diameter | Recommended mounting clamp | ||||
Forced air cooling | Convective air cooling | ||||||||
mm | kg | K/kW | dm3/s | mm | K/kW | W | mm | ||
5SAA21V9000 | 19 | 3.7 | 90 | 100 | 19 | 510 | 150 | 19 | 5SAC10V1600 |
5SAA21V8500 | 50 | 3.6 | 85 | 100 | 47 | 485 | 150 | 47 | 5SAC10V1600 |
![]() Fig. 1 Transient thermal imperdance, Z(th)t. Case to ambient air at different air-flow rates. Pole piece 0 19 mm | ![]() Fig. 2 Transient thermal imperdance, Z(th)t. Case to ambient air at different air-flow rates. Pole piece 0 34 mm |
| ![]() Fig. 4 Thermal resistance Rthca. Case to ambient air and static pressure drop vs flow of cooling air. |
![]() Fig. 5 Convection cooling. Transient thermal imperdance Z(th)t. Case to ambient air. Power loss 150 W. |
Air Cooled Heat sink 5SAA15V9000, 5SAA15V8500
Type YAP 6-01
Air cooled heat sink for double sided cooling of disc housing thyristors and diodes, diameter 40 - 75 mm.
Part number | Max contact diameter | Weight | RthHA at air flow measured with specified device contact diameter | RthHA at power dissipation measured with specified device contact diameter | Recommended mounting clamp | ||||
Forced air cooling | Convective air cooling | ||||||||
mm | kg | K/kW | dm3/s | mm | K/kW | W | mm | ||
5SAA15V9000 | 19 | 3.4 | 90 | 100 | 19 | 510 | 150 | 19 | 5SAC10V1600 |
5SAA15V8500 | 50 | 3.3 | 85 | 100 | 47 | 485 | 150 | 47 | 5SAC10V1600 |
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Air Cooled Heat sink 5SAA21V4500
Type YAP 8-02
Air cooled heat sink for double sided cooling of disc housing thyristors and diodes, diameter 75 mm.
Part number | Max contact diameter | Weight | RthHA at air flow measured with specified device contact diameter | RthHA at power dissipation measured with specified device contact diameter | Recommended mounting clamp | ||||
Forced air cooling | Convective air cooling | ||||||||
mm | kg | K/kW | dm3/s | mm | K/kW | W | mm | ||
5SAA21V4500 | 50 | 8.2 | 45 | 300 | 47 | 240 | 300 | 47 | 5SAC10V1601 |
![]() Fig. 1 Transient thermal imperdance, Z(th)t. Case to ambient air at different air-flow rates. Pole piece 0 47 mm. | ![]() Fig. 3 Thermal resistance Rthca. Case to ambient air and static pressure drop vs flow of cooling air. Pole piece 0 47 mm. |
![]() Fig. 2 Convection cooling. Transient thermal imperdance Z(th)t. Case to ambient air for different power losses. Pole piece 47 mm. |
Air Cooled Heat sink 5SAA21V3500
Type YAP 8-03
Air cooled heat sink for double sided cooling of disc housing thyristors and diodes, diameter 100 -110 mm.
Part number | Max contact diameter | Weight | RthHA at air flow measured with specified device contact diameter | RthHA at power dissipation measured with specified device contact diameter | Recommended mounting clamp | ||||
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| Forced air cooling | Convective air cooling |
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| mm | kg | K/kW | dm3/s | mm | K/kW | W | mm |
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5SAA21V3500 | 80 | 8.2 | 35 | 300 | 78 | 230 | 300 | 78 | 5SAC13V5000 |
![]() Fig. 1 Transient thermal imperdance, Z(th)t. Case to ambient air at different air-flow rates. Pole piece 0 78 mm. | ![]() Fig. 3 Thermal resistance Rthca. Case to ambient air and static pressure drop vs flow of cooling air. Pole piece 0 78 mm. |
![]() Fig. 2 Convection cooling. Transient thermal imperdance Z(th)t. Case to ambient air for different power losses. Pole piece 78 mm. |